1. Raw Material Preparation
Core materials: Polyimide flexible printed circuit (FPC), SMD LED chips, driver ICs, silicone/epoxy encapsulant, magnetic plastic frames, cable connectors, thermal buffer pads.Auxiliary materials: Solder paste, insulating protective film, waterproof sealant, batch labels.Different from rigid glass fiber PCBs, flexible FPC substrates can bend and resist deformation, serving as the core foundation of soft modules.
2. Pre-treatment of Flexible Substrates
Clean FPC boards to remove surface grease and dust; apply plasma activation to improve adhesion of solder paste and glue. Cut substrates to standard module sizes, punch positioning holes for magnetic strips and wiring ports.
3. Automatic SMT Mounting Process
- Solder paste printing via stencil to evenly coat bonding pads;
- High-speed placement machine precisely mounts front RGB LEDs, rear driver ICs and signal connectors with pixel pitch tolerance within ±0.02mm;
- Reflow soldering cures components firmly on flexible boards under constant temperature;
- AOI automatic optical inspection screens out defective boards with offset components, cold solder joints or missing LEDs.
4. Circuit Conductivity & Reinforcement Treatment
Test full circuit connectivity and repair cold solder joints; attach flexible reinforcing films on bending zones to avoid wire breakage after repeated bending; reinforce power & signal cable terminals.

5. Integrated Glue Encapsulation (Core Flexible Technology)
High-elastic transparent silicone fully wraps LEDs and circuits in one pour:
- Front soft light homogenizing layer ensures even illumination and anti-collision performance;
- Full waterproof silicone layer on the back protects ICs and circuits.The elastic glue rebounds without cracking during bending and reaches basic IP65 protection, distinct from hard glue used on rigid modules.

6. Structural Assembly & Forming
- Install elastic plastic frames around the soft board with splicing lock holes reserved;
- Attach magnetic strips and thermal silicone cushions on the back for fast magnetic mounting;
- Trim excess glue and edges to unify module dimensions.
7. Initial Power-on Inspection
Power on single modules to test every pixel’s lighting, color and grayscale; calibrate brightness uniformity and eliminate semi-finished goods with dead pixels, color difference or signal failure.
8. Long-duration High-temperature Aging Test
Place modules in a 50°C constant-temperature aging room for continuous power-on test for 72–96 hours, simulating long-term operation to expose hidden welding defects. Re-inspect after aging to guarantee stable display without blackouts or flicker during frequent bending.
9. Final Inspection, Labeling & Packing
Comprehensive inspection on appearance, bending resistance, waterproof performance and optical indicators; print batch barcode labels. Pack each module separately with anti-static bags and shock-absorbing foam to prevent deformation during transportation.