The SMT production line of LED display modules consists of four core categories: printing, component mounting, soldering and inspection equipment, all used for mounting LED beads, driver ICs and connectors. The full list is as follows:
1. Solder Paste Printers
- Automatic vision solder paste printer: Cooperates with stencils to print solder paste evenly on pads of FPC and PCB boards, including standard models and high-precision versions dedicated to fine-pitch products.
- Auxiliary equipment: Solder paste mixers and solder paste storage refrigerators to maintain paste activity and avoid drying.
2. High-speed LED Mounters (Core Mounting Equipment)
- Dedicated high-speed LED mounter: Optimized for 0808, 1010, 2121, 3535 and other LED chips with multi-head synchronous picking, ideal for mass production of standard modules.
- Multi-functional universal mounter: For mounting driver ICs, resistors, capacitors, cable terminals and special-shaped small connectors.
- Special mounter for FPC flexible boards: Equipped with vacuum suction carrier to prevent bending and deformation of soft substrates for flexible LED modules.
3. Reflow Ovens
- 8-zone / 10-zone hot air reflow oven: Independent temperature control in each section to achieve reliable soldering of LEDs and ICs, avoiding cold joints, bridging and chip burnout.
- Nitrogen reflow oven (for high-end lines): Nitrogen filling reduces oxidation, standard equipment for fine-pitch COB / GOB modules to form smooth, stable solder joints.
4. In-line Inspection Equipment for Post-mount Quality Control
- AOI (Automatic Optical Inspector): Detects missing components, offset chips, dead LEDs, wrong parts and defective solder paste after mounting.
- SPI (Solder Paste Inspection): Checks paste thickness, offset, insufficient or excessive solder after printing to eliminate printing defects in advance.
- 3D AOI 3D optical inspection: Adopted for high-end fine-pitch screens to three-dimensionally measure solder joint height and welding flaws.

5. Board Handling & Auxiliary Conveying Equipment
- Board loader & board unloader: Automatically feed and collect circuit boards for fully automatic line operation.
- Conveyors & buffer stackers: Connect printing machines, mounters, reflow ovens and AOI equipment.
- FPC tooling and static elimination fans: Supporting fixtures specially designed for flexible modules.
6. Depaneling Equipment (Post-soldering Process)
Laser depaneling machine and router depaneling machine: Separate connected PCB/FPC panels into single independent LED modules.